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1

A review of the general theory of thermoelastic stress analysis

Pitarresi, G, Patterson, E A

Journal:

Journal of Strain Analysis for Engineering Design

Year:

2003

Language:

english

File:

PDF, 196 KB

english, 2003

2

Effect of voids on the reliability of BGA/CSP solder joints

Mohammad Yunus, K. Srihari, J.M. Pitarresi, Anthony Primavera

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 752 KB

english, 2003

3

Analytical Solution for Electronic Assemblies Under Vibration

Gharaibeh, Mohammad A., Su, Quang T., Pitarresi, James M.

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 4.68 MB

english, 2016

4

Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

Iannuzzelli, R. J., Pitarresi, J. M., Prakash, V.

Journal:

Journal of Electronic Packaging

Year:

1996

Language:

english

File:

PDF, 768 KB

english, 1996

5

Evaluation of interlaminar delaminations in titanium-graphite fibre metal laminates by infrared NDT techniques

Montinaro, N., Cerniglia, D., Pitarresi, G.

Journal:

NDT & E International

Year:

2018

Language:

english

File:

PDF, 4.33 MB

english, 2018

6

Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method

Gharaibeh, Mohammad A., Pitarresi, James M.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.74 MB

english, 2019

7

Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock

Younis, Mohammad I., Jordy, Daniel, Pitarresi, James M.

Journal:

Journal of Microelectromechanical Systems

Year:

2007

Language:

english

File:

PDF, 562 KB

english, 2007

8

Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

Chaparala, S.C., Roggeman, B.D., Pitarresi, J.M., Sammakia, B.G., Jackson, J., Griffin, G., McHugh, T.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 855 KB

english, 2005

9

Optimal Design Procedures for Active Structures

Cha, J. Z., Pitarresi, J. M., Soong, T. T.

Journal:

Journal of Structural Engineering

Year:

1988

Language:

english

File:

PDF, 608 KB

english, 1988

10

The “Smeared” Property Technique for the FE Vibration Analysis of Printed Circuit Cards

Pitarresi, J. M., Caletka, D. V., Caldwell, R., Smith, D. E.

Journal:

Journal of Electronic Packaging

Year:

1991

Language:

english

File:

PDF, 869 KB

english, 1991

11

Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

Pitarresi, J. M., Primavera, A. A.

Journal:

Journal of Electronic Packaging

Year:

1992

Language:

english

File:

PDF, 738 KB

english, 1992

12

Stress Analysis of Component Attachments to Printed Circuit Boards

Prakash, V., Engel, P.A., Pitarresi, J.M., Albert, T., Westby, G.

Journal:

Soldering & Surface Mount Technology

Year:

1992

Language:

english

File:

PDF, 327 KB

english, 1992

13

A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards

Pitarresi, J. M., Di Edwardo, A. V.

Journal:

Journal of Electronic Packaging

Year:

1993

Language:

english

File:

PDF, 774 KB

english, 1993

14

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling

Chaparala, S., Pitarresi, J. M., Meilunas, M.

Year:

2006

Language:

english

File:

PDF, 291 KB

english, 2006

15

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

Park, S. B., Shah, Chirag, Kwak, Jae B., Jang, Changsoo, Chung, Soonwan, Pitarresi, James M.

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 506 KB

english, 2008

16

Accelerated Vibration Reliability Testing of Electronic Assemblies using Sine Dwell with Resonance Tracking

Su, Quang T., Gharaibeh, Mohammad, Stewart, Aaron, Pitarresi, James, Anselm, Martin K.

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 2.04 MB

english, 2018

17

Analytical model for the transient analysis of electronic assemblies subjected to impact loading

Gharaibeh, Mohammad A., Su, Quang T., Pitarresi, James M.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.22 MB

english, 2018

18

Controlled Release of IgG by Novel UV Induced Polysaccharide/Poly(amino acid) Hydrogels

Giuseppe Tripodo, Giovanna Pitarresi, Gennara Cavallaro, Fabio Salvatore Palumbo, Gaetano Giammona

Journal:

Macromolecular Bioscience

Year:

2009

Language:

english

File:

PDF, 388 KB

english, 2009

19

A comparative evaluation of crashworthy composite sandwich structures

G. Pitarresi, J.J. Carruthers, A.M. Robinson, G. Torre, J.M. Kenny, S. Ingleton, O. Velecela, M.S. Found

Journal:

Composite Structures

Year:

2007

Language:

english

File:

PDF, 1.99 MB

english, 2007

20

In situ gel forming graft copolymers of a polyaspartamide and polylactic acid: Preparation and characterization

Giovanna Pitarresi, Fabio S. Palumbo, Antonella Albanese, Mariano Licciardi, Filippo Calascibetta, Gaetano Giammona

Journal:

European Polymer Journal

Year:

2008

Language:

english

File:

PDF, 663 KB

english, 2008

21

Mechanical characterization of polysaccharide/polyaminoacid hydrogels as potential scaffolds for tissue regeneration

Pietro Matricardi, Giovanna Pitarresi, Fabio Salvatore Palumbo, Chiara Di Meo, Antonella Albanese, Tommasina Coviello, Claudia Cencetti, Calogero Fiorica, Gaetano Giammona

Journal:

Macromolecular Research

Year:

2011

Language:

english

File:

PDF, 382 KB

english, 2011

22

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Board level energy correlation and interconnect reliability modeling under drop impact

Agrawal, Akash, Levo, Tim, Pitarresi, James, Roggeman, Brian

Year:

2009

Language:

english

File:

PDF, 1013 KB

english, 2009

23

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact

Park, Seungbae, Shah, Chirag, Kwak, Jae, Jang, Changsoo, Pitarresi, James, Park, Taesang, Jang, Seyoung

Year:

2007

Language:

english

File:

PDF, 6.04 MB

english, 2007

24

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Random vibration test for electronic assemblies fatigue life estimation

Al-Yafawi, Abdullah, Patil, Saket, Yu, Da, Park, Seungbae, Pitarresi, James, Goo, Namseo

Year:

2010

Language:

english

File:

PDF, 984 KB

english, 2010

25

Lock-In Signal Post-Processing Techniques in Infra-Red Thermography for Materials Structural Evaluation

Journal:

Experimental Mechanics

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

26

Resveratrol depletes mitochondrial DNA and inhibition of autophagy enhances resveratrol-induced caspase activation

Prabhu, Varun, Srivastava, Pragya, Yadav, Neelu, Amadori, Michael, Schneider, Andrea, Seshadri, Athul, Pitarresi, Jason, Scott, Rachael, Zhang, Honghao, Koochekpour, Shahriar, Gogada, Raghu, Chandra,

Journal:

Year:

2013

Language:

english

File:

PDF, 1.03 MB

english, 2013

27

On the history of torsional stress concentrations in shafts: From electrical analogies to numerical methods

Ajovalasit, A., Nigrelli, V., Pitarresi, G., Virzi Mariotti, G.

Journal:

Journal of Strain Analysis for Engineering Design

Year:

2014

Language:

english

File:

PDF, 2.90 MB

english, 2014

28

Photo-Cross-Linked Hydrogels with Polysaccharide−Poly(amino acid) Structure: New Biomaterials for Pharmaceutical Applications

Pitarresi, Giovanna, Pierro, Paola, Palumbo, Fabio S., Tripodo, Giuseppe, Giammona, Gaetano

Journal:

Biomacromolecules

Year:

2006

Language:

english

File:

PDF, 168 KB

english, 2006

29

Ferulic acid inhibits oxidative stress and cell death induced by Ab oligomers: Improved delivery by solid lipid nanoparticles

Picone, Pasquale, Bondi, Maria L., Picone, Pasquale, Bondi, Maria L., Montana, Giovanna, Bruno, Andreina, Pitarresi, Giovanna, Giammona, Gaetano, Di Carlo, Marta

Journal:

Free Radical Research

Year:

2009

Language:

english

File:

PDF, 654 KB

english, 2009

30

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of temperature on transition in failure modes for high speed impact test of solder joint and comparison with board level drop test

Guruprasad, Pradosh, Pitarresi, James

Year:

2010

Language:

english

File:

PDF, 2.94 MB

english, 2010

31

Absorption kinetics and swelling stresses in hydrothermally aged epoxies investigated by photoelastic image analysis

Pitarresi, Giuseppe, Scafidi, Michele, Alessi, Sabina, Di Filippo, Maria, Billaud, Claude, Spadaro, Giuseppe

Journal:

Polymer Degradation and Stability

Year:

2015

Language:

english

File:

PDF, 2.80 MB

english, 2015

32

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Assessment of PCB pad cratering resistance by joint level testing

Roggeman, Brian, Borgesen, Peter, Li, Jing, Godbole, Guarav, Tumne, Pushkraj, Srihari, K., Levo, Tim, Pitarresi, James

Year:

2008

Language:

english

File:

PDF, 956 KB

english, 2008

33

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Impact of board configuration and shock loading conditions for board level drop test

Guruprasad, Pradosh, Roggeman, Brian, Pitarresi, James

Year:

2011

Language:

english

File:

PDF, 1.78 MB

english, 2011

34

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Structural optimization of an electrical spring contact

Macek, T., Pitarresi, J.M.

Year:

1993

Language:

english

File:

PDF, 769 KB

english, 1993

35

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - A lamination study of a composite LCD flat panel display

Greenfield, P., Pitarresi, J., Lehmann, G., Skinner, D., Lee, J., Sammakia, B., Zou, J.

Year:

2002

Language:

english

File:

PDF, 634 KB

english, 2002

36

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Comparison of joint level impact fatigue resistance and board level drop test

Guruprasad, Pradosh, Pitarresi, James

Year:

2009

Language:

english

File:

PDF, 1.10 MB

english, 2009

37

In-situ forming gel-like depot of a polyaspartamide-polylactide copolymer for once a week administration of sulpiride

Fiorica, Calogero, Palumbo, Fabio Salvatore, Pitarresi, Giovanna, Giorgi, Mario, Calascibetta, Filippo, Giammona, Gaetano

Journal:

Journal of Pharmacy and Pharmacology

Year:

2015

Language:

english

File:

PDF, 692 KB

english, 2015

38

Investigation on the Influence of the Surface Resin Rich Layer on the Thermoelastic Signal from Different Composite Laminate Lay-Ups

Pitarresi, G., Conti, A., Galietti, U.

Journal:

Applied Mechanics and Materials

Year:

2005

Language:

english

File:

PDF, 338 KB

english, 2005

39

Thermoelastic stress analysis by means of an infrared scanner and a two-dimensional fast Fourier transform-based lock-in technique

Pitarresi, G, D'Acquisto, L, Siddiolo, A M

Journal:

Journal of Strain Analysis for Engineering Design

Year:

2008

Language:

english

File:

PDF, 715 KB

english, 2008

40

Review of photoelastic image analysis applied to structural birefringent materials: glass and polymers

Scafidi, Michele, Pitarresi, Giuseppe, Toscano, Andrea, Petrucci, Giovanni, Alessi, Sabina, Ajovalasit, Augusto

Journal:

Optical Engineering

Year:

2015

Language:

english

File:

PDF, 2.33 MB

english, 2015

41

Mechanical Behaviour of a Green Sandwich Made of Flax Reinforced Polymer Facings and Cork Core

Mancuso, Antonio, Pitarresi, Giuseppe, Tumino, Davide

Journal:

Procedia Engineering

Year:

2015

File:

PDF, 1.80 MB

2015

42

The future use of structural composite materials in the automotive industry

Mangino, Enrico, Carruthers, Joe, Pitarresi, Giuseppe

Journal:

International Journal of Vehicle Design

Year:

2007

Language:

english

File:

PDF, 474 KB

english, 2007

43

Mechanical properties of basalt fiber reinforced composites manufactured with different vacuum assisted impregnation techniques

Scalici, T., Pitarresi, G., Badagliacco, D., Fiore, V., Valenza, A.

Journal:

Composites Part B: Engineering

Year:

2016

Language:

english

File:

PDF, 16.30 MB

english, 2016

44

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

Chaparala, S., Pitarresi, J. M., Parupalli, S., Mandepudi, S., Meilunas, M.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 948 KB

english, 2006

45

Thermal NDE of thick GRP panels by means of a Pulse Modulated Lock-In Thermography technique

Journal:

EPJ Web of Conferences

Year:

2010

Language:

english

File:

PDF, 902 KB

english, 2010

46

A Simple Technique for the Rapid Estimation of the Optimal Support Locations for a Vibrating Plate

Pitarresi, J. M., Kunz, R. J.

Journal:

Journal of Vibration Acoustics Stress and Reliability in Design

Year:

1992

Language:

english

File:

PDF, 750 KB

english, 1992

47

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Applied Mechanics - Computationally Efficient Approaches to Simulate the Dynamics of Microbeams Under Mechanical Shock

Younis, Mohammad I., Jordy, Danial, Pitarresi, James M.

Year:

2006

Language:

english

File:

PDF, 443 KB

english, 2006

48

Using FEM simulation to predict structural performances of a sailing dinghy

Mancuso, A., Pitarresi, G., Tumino, D.

Journal:

International Journal on Interactive Design and Manufacturing (IJIDeM)

Year:

2017

Language:

english

File:

PDF, 3.12 MB

english, 2017

49

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Wrinkling of Thin Membrane Under Thermal Loading

Gao, Jia, Park, Seungbae, Pitarresi, James, Homentcovschi, Dorel

Year:

2006

Language:

english

File:

PDF, 704 KB

english, 2006

50

Synthesis and evaluation of thermo-rheological behaviour and ionotropic crosslinking of new gellan gum-alkyl derivatives

Agnello, Stefano, Palumbo, Fabio Salvatore, Pitarresi, Giovanna, Fiorica, Calogero, Giammona, Gaetano

Journal:

Carbohydrate Polymers

Year:

2018

Language:

english

File:

PDF, 1.66 MB

english, 2018